本栏目尚未翻译。以下内容按原文以英文显示。 阅读英文版本.
Banks and Blackstone line up $63bn to finance Broadcom AI chips leased to Anthropic
What changed
Bank of America, Citi and Morgan Stanley arrange first-lien financing and Blackstone the committed second-lien portion for a new special purpose vehicle that will buy Broadcom XPU accelerators and networking and lease them to Anthropic. Broadcom provides residual value support equal to the first-lien portion. Deliveries are expected from calendar 2027.
View original source (opens in a new tab)
Read the original: Broadcom: Banks and Blackstone line up $63bn to finance Broadcom AI chips leased to Anthropic (opens in a new tab)
We summarise in our own words and link the source. Figures are as reported by the source and not independently verified. Report a correction.
Related index data
A supplier link means the company is named in the story or offers this kind of product. It does not mean a contract unless the story says so.
Related on CoolPower Index: Chip power and cooling, AI news.
More in AI and Data Centre Chips
- CoreWeave's chief executive cancels his share sale plan after Q3 results, keeping 1.85 GW of active power as the end-2026 target 11 Nov 2026
- AMD makes 6th Gen EPYC 'Venice' server CPUs generally available, with Helion agentic AI racks in liquid-cooled and air-cooled versions 10 Nov 2026
- Anthropic's amended IPO filing raises its Microsoft compute commitment to at least US$47.2 billion and says a US$34.9 billion Lambda agreement can now be terminated 10 Nov 2026